SKU:S007
Stamp-S3 is a highly integrated embedded core module based on the Espressif ESP32-S3FN8 SoC with 8 MB SPI flash. It features a high-performance 32-bit Xtensa LX7 dual-core processor running at up to 240 MHz and integrates a 5 V-to-3.3 V power circuit, an RGB status LED, and a programmable button.
The module exposes 23 GPIO pins of the ESP32-S3 on both 1.27 mm and 2.54 mm pitch headers, supporting multiple mounting options such as SMT, DIP male header, DIP female header, and fly-wire.
With its compact size, powerful performance, rich IO resources, and low-power consumption, the module is ideal for embedded IoT controller applications.
Specification | Parameter |
---|---|
SoC | ESP32-S3FN8 |
DC-DC | Highly integrated MUN3CAD01-SC |
Flash | 8 MB |
Input Voltage | 5 V |
Power Consumption | Sleep mode: – USB Type-C power: DC 5 V @ 400.67 µA – VIN_5V power: DC 5 V @ 310.89 µA; Standby mode: – USB Type-C power: DC 5 V @ 33.04 mA; – VIN_5V power: DC 5 V @ 33.56 mA |
Human Interface | Programmable physical button × 1, programmable RGB LED (WS2812B-2020) × 1 |
Antenna Type | 2.4 G 3D antenna |
Peripheral Interface | Touch sensor, SD/SDIO/MMC host controller, SPI, SDIO/SPI slave controller, EMAC, Motor PWM, LED PWM, UART, I2C, I2S, GPIO, Pulse Counter |
IO Ports × 23 | G0/G1/G2/G3/G4/G5/G6/G7/G8/G9/G10/G11/G12/G13/G14/G15/G39/G40/G41/G42/G43/G44/G46 |
Connection Method | SMT/DIP (2.54 mm & 1.27 mm pitch) / Fly-wire |
IO Pitch | 2.54 mm & 1.27 mm |
LCD FPC Pitch | 0.5 mm @ 12-pin or 8-pin |
Operating Temp. | 0 ~ 40 °C |
Product Size | 24.0 x 18.0 x 4.7 mm |
Product Weight | 2.8 g |
Package Size | 138.0 x 93.0 x 10.5 mm |
Gross Weight | 7.5 g |
To enter download mode, press and hold the G0 button on the Stamp-S3 before powering on, then release it after power is applied.\