SKU:S007
Stamp-S3 is a highly integrated embedded main control core module. It uses the Espressif ESP32-S3FN8 main control chip, equipped with 8M SPI flash memory, and features a high-performance Xtensa 32-bit LX7 dual-core processor with a main frequency of up to 240MHz. It integrates a highly integrated 5V to 3.3V circuit, RGB status indicator, and programmable button. The module exposes 23 GPIOs from the ESP32-S3 and presents them in 1.27MM/2.54MM spacing, supporting SMT, DIP pin headers, DIP sockets, and flying leads for various usage scenarios.
This product is characterized by its compact size, powerful performance, rich expansion IOs, and low power consumption. This module is suitable for IoT applications requiring embedded main control modules.
Specification | Parameters |
---|---|
MCU | ESP32-S3FN8 |
DCDC | Highly integrated MUN3CAD01-SC |
Flash | 8MB |
Input Voltage | 5V |
Human-Machine Interface | Programmable physical button x 1, programmable RGB LED (WS2812B-2020) x 1 |
Antenna Type | 2.4G 3D antenna |
Module Resource Interface | Touch sensor, SD/SDIO/MMC host controller, SPI, SDIO/SPI slave controller, EMAC, motor PWM, LED PWM, UART, I2C, I2S, GPIO, pulse counter |
IO Interface x23 | G0/G1/G2/G3/G4/G5/G6/G7/G8/G9/G10/G11/G12/G13/G14/G15/G39/G40/G41/G42/G43/G44/G46 |
Connection Method | SMT/DIP (2.54mm and 1.27mm spacing)/flying leads |
IO Interface Spacing | 2.54mm and 1.27mm |
LCD Interface Spacing | 0.5mm@12pin or 8pin |
Operating Temperature | 0 ~ 40°C |
Product Dimensions | 24.0 x 18.0 x 4.7mm |
Product Weight | 2.8g |
Package Dimensions | 138.0 x 93.0 x 10.5mm |
Gross Weight | 7.5g |